Edge-Connected Semiconductor Systems

ABSTRACT

Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.

BACKGROUND

Computer system hardware often includes one or more discrete dataprocessing devices coupled to a printed circuit board (“PCB”). Forexample, one or more single- or multi-core central processing unit(“CPU”) packages may be mounted to a host system PCB. The host systemPCB may constitute a motherboard in a stand-alone computer, such as aworkstation computer, or may constitute a system board in a single- ormulti-node rack mounted server, such as in a data center.

Such hardware may additionally include one or more discrete coprocessoror accelerator units. In general, a coprocessor or accelerator unit is adata processing device that serves to complement or supplement theoperations of a CPU. A coprocessor or accelerator unit may be identicalin function to a CPU or may have more specialized functions, as is thecase with a graphics processing unit (“GPU”). A GPU is typicallyequipped to accelerate specialized operations, such as matrixmultiplications, that are required to implement a computer graphicspipeline. In order to do so, a GPU may include at least onehigh-performance arithmetic logic unit (“ALU”) coupled to ahigh-bandwidth local memory. Because of the presence of thehigh-performance ALU and the high-bandwidth local memory, a GPU not onlycan accelerate graphics-related computations, but also can be employedto perform more general mathematical operations unrelated to graphics.For example, GPUs have been employed to support ALU-intensive operationsthat are required by certain artificial intelligence algorithms andworkflows.

Numerous practical problems arise in the context of designing andmanufacturing computer system hardware to be suitable for use inapplications such as those just described as well as others. First, astechnology advances, the compute demands that are placed on the CPUs andthe coprocessor and/or accelerator units increase. This, in turn,requires that the various processing units be redesigned periodically tomake use of new silicon technologies and new internal architectures.Such redesign efforts inevitably are accompanied by significant expenseand technology risk. Second, transferring data between the processingunits in a host computer requires efficient support from specializedsubsystems and data pathways on the motherboard or the system boardPCBs. This, in turn, complicates the design and manufacture of the PCBs,which complication also brings added expense and technology risk. Third,the cooling requirements of high-performance processors, combined withthe space constraints that are imposed by fixed form factor systemboards, often lead to a desire on the part of system designers for moreflexibility in component selection and placement.

BRIEF DESCRIPTION OF THE DRAWINGS

Techniques and apparatus for addressing these and other challenges willbe described below with reference to the accompanying drawings, in whichlike reference numbers generally denote like or similar elements.

FIG. 1 is a top view illustrating four integrated circuit packagesformed into a ganged assembly in accordance with embodiments.

FIG. 2 is a side view illustrating the integrated circuit packages ofFIG. 1 coupled to a PCB in accordance with embodiments.

FIG. 3 is a top view illustrating the integrated circuit packages ofFIG. 1 coupled to a PCB in accordance with embodiments, wherein the PCBis a peripheral component interconnect express (“PCIe”) card.

FIG. 4 is a side view illustrating the PCIe card of FIG. 3 coupled to amotherboard or system of a host system computer in accordance withembodiments.

FIG. 5A is an oblique view illustrating six integrated circuit packagesformed into two ganged assemblies and coupled to a PCB in accordancewith embodiments.

FIG. 5B is an orthographic view of the integrated circuit packages ofFIG. 5A schematically illustrating a cooling device disposed between theganged assemblies in accordance with embodiments.

FIG. 6 is a block diagram schematically illustrating example circuitrywithin two edge-connected integrated circuit packages, coupled tocircuitry within a host computer system, in accordance with embodiments.

FIGS. 7-9 are block diagrams schematically illustrating edge-connecteddata communication links coupling several integrated circuit packagestogether in various network topologies in accordance with embodiments.

FIG. 10 is an oblique view illustrating an integrated circuit substrateand a single-chip connector frame, together forming a substrate assemblyin accordance with embodiments.

FIG. 11 is a sectional view of the substrate and connector frame of FIG.10, taken along the section indicated in FIG. 10, illustrating anexample socket in accordance with embodiments, wherein the substrate iscoupled to the connector frame in accordance with a first exampletechnique.

FIG. 12 is a sectional view illustrating the example socket of FIG. 11,wherein the substrate is coupled to the connector frame in accordancewith a second example technique.

FIG. 13 is an orthogonal view of the example socket of FIG. 11.

FIG. 14 illustrates a class of removable pins for use with the socketsof FIGS. 10-13 and shows two different example pin retention features inaccordance with embodiments.

FIGS. 15 and 16 are orthogonal views illustrating integrated circuitpackages, each one including a respective single-chip connector frame,wherein the packages are coupled to one another by removable pins inaccordance with embodiments.

FIG. 17 is a perspective view illustrating a multi-chip connector framein accordance with embodiments.

FIG. 18 is a sectional view of the multi-chip connector frame of FIG.17, taken along the section indicated in FIG. 17, wherein one of the twointegrated circuit packages depicted in FIG. 17 is shown outside of theconnector frame.

FIGS. 19-21 are block diagrams schematically illustrating integratedcircuit packages housed in multi-chip connector frames, forming variousganged assemblies, and coupled to one another by edge-connectedconductive paths in various network topologies in accordance withembodiments.

FIG. 22 is a flow diagram illustrating an example method ofmanufacturing edge-connected semiconductor assemblies in accordance withembodiments.

FIGS. 23A-23C are orthogonal views illustrating example integratedcircuit packages having edge contacts, being assembled together andcoupled to a PCB in accordance with the method of FIG. 22.

DETAILED DESCRIPTION

This disclosure describes multiple embodiments by way of example andillustration. It is intended that characteristics and features of alldescribed embodiments may be combined in any manner consistent with theteachings, suggestions and objectives contained herein. Thus, phrasessuch as “in an embodiment,” “in one embodiment,” and the like, when usedto describe embodiments in a particular context, are not intended tolimit the described characteristics or features only to the embodimentsappearing in that context.

The phrases “based on” or “based at least in part on” refer to one ormore inputs that can be used directly or indirectly in making somedetermination or in performing some computation. Use of those phrasesherein is not intended to foreclose using additional or other inputs inmaking the described determination or in performing the describedcomputation. Rather, determinations or computations so described may bebased either solely on the referenced inputs or on those inputs as wellas others. The phrase “configured to” as used herein means that thereferenced item, when operated, can perform the described function. Inthis sense an item can be “configured to” perform a function even whenthe item is not operating and is therefore not currently performing thefunction. Use of the phrase “configured to” herein does not necessarilymean that the described item has been modified in some way relative to aprevious state. “Coupled” as used herein refers to a connection betweenitems. Such a connection can be direct or can be indirect throughconnections with other intermediate items. Uses of the term “coupled”and its variants herein include the coupling of components byelectrically conductive connections or paths, except where the contextclearly indicates otherwise. Terms used herein such as “including,”“comprising,” and their variants, mean “including but not limited to.”Articles of speech such as “a,” “an,” and “the” as used herein areintended to serve as singular as well as plural references except wherethe context clearly indicates otherwise.

The term “rectangle” as used herein includes square shapes as well asnon-square rectangular shapes.

FIG. 1 is a top view illustrating four edge-connected integrated circuitpackages 102, 104, 106, 108 coupled to one another in a ganged assembly100. Each of the integrated circuit packages includes a respectivesubstrate assembly 110, 112, 114, 116. Each of the substrate assembliesmay include one or more integrated circuit dies mounted thereon orincluded therein. In the embodiment shown, edge contacts disposed oneach one of the substrate assemblies are coupled to corresponding edgecontacts on another one of the substrate assemblies bypackage-to-package conductive paths 118.

FIG. 2 illustrates the ganged assembly of FIG. 1 coupled to a generallyplanar PCB 200. As can be seen in FIG. 2, each one of the substrateassemblies is generally planar and has a top side 202 and a bottom side204. An edge 206 extends between the top and the bottom sides. The edgecontacts of each integrated circuit package are disposed on the edge ofthe substrate assembly of the package. In the embodiment shown, eachintegrated circuit package also includes host system contacts 208 formedon the bottom side of the respective substrate assembly. The gangedassembly is coupled to the PCB by coupling the host system contacts tocorresponding contacts on or in the PCB as shown.

Host system contacts 208 may take a variety of forms. In the illustratedembodiment, the host system contacts take the form of a ball grid array.In other embodiments, the host system contacts may take other forms,such as a land grid array or a pin grid array. The correspondingcontacts on or in the PCB may be formed on or in the PCB itself, of maytake the form of one or more sockets mounted to the PCB and in which thehost system contacts on the integrated circuit packages of the gangedassembly are inserted. In the embodiment shown, the planes of thesubstrate assemblies of the integrated circuit packages aresubstantially parallel with the plane of the PCB to which the substrateassemblies are coupled.

As can be seen in FIG. 2, the package-to-package conductive pathscoupled between the edge contacts of the substrate assemblies do notinclude traces formed on or in the PCB. In this manner, datacommunication between the integrated circuit packages of the gangedassembly can be performed directly, using package-to-package conductivepaths 118. This, in turn, avoids the need to provide supportingcircuitry and/or conductive pathways on the PCB for directpackage-to-package communications.

The PCB may itself take a variety of forms. For example, the PCB maycomprise a motherboard of a stand-alone computer, such as a workstation,desktop or laptop, or it may comprise a system board of a rack-mountedserver computer. In still further embodiments, the PCB may constitute anadd-on card that is configured to be mounted to a motherboard or systemboard of a host computer. FIGS. 3 and 4 illustrate such an example. InFIG. 3, the ganged assembly is shown coupled to a peripheral componentinterconnect express (“PCIe”) card 300. In FIG. 4, the PCIe card isshown mounted to a motherboard 400 of a host computer. One or more CPUs402 may also be installed on the motherboard, as shown. In suchembodiments, the CPUs may perform data communications with any or all ofthe integrated circuit packages in the ganged assembly via host systemcontacts 208 and corresponding interconnect circuitry and data pathwayson or in the PCB and/or on or in the add-on card.

FIG. 5A illustrates a class of embodiments 500 in which the planes ofthe substrate assemblies of the integrated circuit packages are orientedorthogonally to the plane of the PCB to which they are coupled. Twoganged assemblies 502, 504 of edge-connected integrated circuit packagesare shown. Each of the substrate assemblies has a generally rectangularshape such that its edge comprises four edge sections, eachcorresponding respectively to one of the four sides of the rectangle.For example, the four edge sections of one of the integrated circuitpackages are shown at 501, 503, 505, 507. In each of the integratedcircuit packages, edge contacts may be disposed on each of the four edgesections. A first subset of the edge sections on a given integratedcircuit package (for example, edge sections 503 and/or 507), have theiredge contacts coupled to edge contacts on another one of the integratedcircuit packages by package-to-package conductive paths 506. As can beseen in the drawing, package-to-package conductive paths 506 do notinclude traces formed on or in the PCB. A second subset of the edgesections—for example, edge sections 501—have their edge contacts coupledto corresponding contacts 512 on or in the PCB. In the embodiment shown,the latter coupling is accomplished by conductive paths 510 extendingbetween edge sections 501 and sockets 512 mounted to the PCB. Sockets512 are each coupled to corresponding contacts on or in the PCB. In suchembodiments, the edge contacts disposed on edge sections 501 of theintegrated circuit packages in the ganged assemblies constitute hostsystem contacts.

As was the case for the embodiments described in relation to FIGS. 1-4,PCB 400 may comprise a motherboard of a stand-alone computer, a systemboard of a rack-mounted server computer, or an add-on card that isconfigured to be mounted to a motherboard or system board of a hostcomputer. In the illustrated embodiment, PCB 400 has a CPU 402 mountedthereon, which is coupled to the host system contacts of the gangedassemblies by circuitry and conductive paths on or in the PCB. Inembodiments wherein the PCB is an add-on card, the CPU may be disposedon a motherboard or system board and coupled to the host system contactsby circuitry and conductive paths provided on or in themotherboard/system board and on or in the add-on card.

The configurations of the integrated circuit packages in gangedassemblies 502, 504 correspond to a grid-like mesh network topology inwhich each integrated circuit package is directly edge-connected to anadjacent integrated circuit package in the same row. The illustratedmesh network topology may be extended to a toroidal mesh topology inwhich one or more edge contacts of the integrated circuit packages inone row may be connected to edge contacts of an adjacent integratedcircuit package in another row. This may be accomplished by coupling oneor more bridge connectors to edge contacts of the integrated circuitpackages. For example, a bridge connector 516 may be coupled to theintegrated circuit packages at one or both ends of the two rows of theganged assemblies, as shown, to establish a wrap-around connection atthe ends of two rows in the mesh network. And a bridge connector 518 maybe coupled to the tops of any two adjacent integrated circuit packagesin the ganged assemblies, as shown, to establish a wrap-aroundconnection at the ends of two columns in the mesh network. Each of thebridge connectors may, for example, comprise a frame 518, to which setsof pins 520, 522 are mounted. Each of pins 520 may be coupled directlyto a corresponding one of pins 522 by conductive pathways formed on orin the frame, as indicated generally at 524.

FIG. 5B is an orthographic view of the integrated circuit packages ofFIG. 5A, schematically illustrating a cooling device 526 disposedbetween the ganged assemblies in accordance with some embodiments. Thecooling device may be disposed between the ganged assemblies such thatopposite sides of the device are in thermal contact with a top or bottomside of one or more of the integrated circuit packages in the gangedassemblies, as shown. Such a cooling device may take a variety of forms,including an active fan-driven device, an active liquid cooling system,or a passive device such as a heat sink. In some embodiments, thecooling device may be mounted to the PCB for structural support, asindicated generally at 528.

In any of the above edge-connected semiconductor systems, each of theintegrated circuit packages making up the ganged assembly may include atleast one integrated circuit die configured to perform functionssuitable for use in a multi-processor computer system. For example, thedies in each of the integrated circuit packages may include circuitryfor implementing the functions of a CPU or the functions of acoprocessor or accelerator unit. Such functions may include a dataprocessing unit, a local memory associated with the data processingunit, and a data communication unit configured to performpackage-to-package communication with one or more of the otherintegrated circuit packages in the ganged assembly, and/or to performdata communication with elements of the host system such as CPU 402. Insome embodiments, one or more of the integrated circuit packages in theganged assembly may comprise a GPU. In still further embodiments, eachof the integrated circuit packages in the ganged assembly or gangedassemblies may be substantially identical.

In any of these variants, the integrated circuit packages in the gangedassembly or ganged assemblies may be configured to implement one or moretypes of parallel processing regimes in order to accelerate largecomputations. In such parallel processing regimes, a large computationis generally divided into smaller sub-computations, which are thendelegated to the individual data processing units in the multi-processorsystem. After the data processing units have completed their smallersub-computations, the results of the sub-computations are combined tocomplete the original, larger computation. As an example, CPU 402 maydelegate sub-computations to multiple GPUs in the ganged assembly orassemblies, and then combine results produced by the multiple GPUs toconstruct a single, final result.

In ideal cases, each of the data processing units completes itssub-computation independently of the other data processing units so thatthe sub-computations execute simultaneously and efficiently. In morepractical cases, however, it often happens that the sub-computationsbeing performed by the individual data processors in the multi-processorsystem are not entirely independent. For example, it can be the casethat a single block of memory may contain data that is of interest totwo different data processors at various times while they perform theirrespective sub-computations.

FIG. 6 illustrates an example class of embodiments 600 that can be usedto implement parallel computation while addressing such practicalscenarios beneficially. System 600 includes two or more integratedcircuit packages 602, 603 coupled together in a ganged assembly by edgeconnected package-to-package conductive paths 606. Thepackage-to-package conductive paths couple edge contacts 604 on each ofthe integrated circuit packages to edge contacts on the other integratedcircuit package. Each of the integrated circuit packages includescircuitry for implementing one or more data communication units 608, adata processing unit 610, a local memory 612, and a unified memorycontroller 614. It should be noted that the illustration of FIG. 6 is ablock diagram that illustrates such a system logically. The physicallocations of the various blocks depicted in the drawing may vary inactual embodiments, and their functions would typically be provided bycircuitry disposed within an integrated circuit die that is mounted onor in the respective substrate assembly. For example, the datacommunication unit may by located on the die and coupled to edgecontacts disposed on all four edge sections of a rectangular substrateassembly to which the die is mounted. Moreover, the data communicationunits may be configured to implement data communication between theedge-connected integrated circuit packages themselves, or between arespective one of the integrated circuit packages and elements of hostsystem 616, or both. The host system, in turn, may include a datacommunication unit 609, a unified memory controller 615, a host systemmemory 618, and one or more CPUs 620.

Each local memory 612 is associated with a data processing unit 610 atleast in the sense that the data processing unit can access data blocksstored in the local memory. In the embodiments shown, such access isaccomplished through a unified memory controller 614 that is coupled tothe local memory, to the data processing unit, and to the datacommunication unit as shown. Similarly, the unified memory controller615 in the host system is coupled to the host system memory, to the CPU,and to data communication unit 609 of the host system.

The unified memory controllers may be configured to function togethersuch that they implement a unified memory system, as follows. Oncesub-computations have been assigned to each of the data processing units610, both of the data processing units and the CPU may simultaneouslyhave access to a given data block within a shared memory address spaceand may use the same memory address to access the data block. Theaddress of the data block may correspond, for example, to the contentsof a single pointer that is used in common by software executing on thetwo data processing units and on the CPU. (In some embodiments, the dataprocessing units and the CPU may each have a separate copy of thepointer, stored locally.) Assume that such a pointer contains thestarting address of data block 622 stored in the host system memory.When the data processing unit in integrated circuit package 602 requiresaccess to the data block (e.g., when software executing in the dataprocessing unit dereferences the pointer), the unified memory controllerin package 602 uses its data communication unit to perform a memorytransaction to access the data block, which results in the data blockbeing transferred from the host system memory to the local memory inpackage 602. Specifically, the unified memory controller in host system615 may respond to the memory transaction by supplying the data blockfrom system memory, using data communication unit 609. Later, when thedata processing unit in integrated circuit package 603 requires accessto the data block, the unified memory controller in package 603 uses itsdata communication unit to perform a memory transaction to access thedata block. The unified memory controller in package 602 responds to thememory transaction by supplying the data block from its local memory. Inthe course of performing the memory transactions, suitable datastructures may be updated in each of packages 602, 603 and in the hostsystem to indicate whether the locally-stored copy of the data block iscurrently valid.

Because memory transactions may occur directly between the twointegrated circuit packages 602, 603 using edge-connectedpackage-to-package conductive paths 606, memory can be shared betweenthe data processing units contained in the two integrated circuitpackages without the need to involve components in the host system orcomponents on the PCB to which the packages are attached. Thus, relatedsub-computations being performed by the two data processing units mayproceed more efficiently than in prior art systems.

Any suitable protocol may be used to implement the memory transactionsbetween the edge connected integrated circuit packages and betweeneither of the integrated circuit packages and the host system. In someembodiments, data communication units 608 and 609 may be configured toimplement one or more high-speed serial communication links 624, 626.For example, one or more communication links 624 may be implementeddirectly between packages 602, 603 by using conductive paths 606 indifferential pairs to form sub-links, each sub-link configured totransfer data in a single direction. Multiple sub-links may be combinedto form a single bi-directional link. These links may be used to performthe memory transactions described above.

Similar techniques may be employed to implement host system links 626,such that the same type of high-speed communication link that is usedfor direct communications between the packages is also used fortransactions between a package and the host system. In otherembodiments, a different protocol and/or physical layer may be used toperform transactions between either one of the packages and the hostsystem. For example, in embodiments such as those illustrated in FIGS. 3and 4, links 628 may be implemented between each one of the packages anda PCIe system 300. The PCIe system may, in turn, communicate with thehost system via the industry-standard PCIe protocol using a link 630.

The protocols and physical layers used to implement high-speed datacommunication links 624 may be further configured to implement a varietyof network topologies between edge-connected integrated circuit packagesand/or the host system. For example, FIG. 7 illustrates a class ofembodiments 700 in which integrated circuit packages 702 are coupled bydata communication links 724 to form a grid-like mesh network. In such amesh network, each integrated circuit package is coupled to adjacentintegrated circuit packages in the same row and/or to adjacentintegrated circuit packages in the same column. FIG. 8 illustrates aclass of embodiments 800, in which integrated circuit packages 802 arecoupled by data communication links 824 in an all-to-all topology. In anall-to-all topology, each integrated circuit package has a direct datacommunication link to every other integrated circuit package in thenetwork. FIG. 9 illustrates a class of embodiments 900 in which anall-to-all topology is accomplished logically, instead of physically asin embodiments 800. In embodiments 900, each integrated circuit package902 has a direct data communication link 924 to a switch unit 904.All-to-all connectivity is accomplished by the functions of switch unit904, which may be configured to route transactions among the integratedcircuit packages based on source and destination identifiers associatedwith the respective transactions. For example, source and receiveridentifiers may be embedded in packet headers associated with thetransactions, and switch unit 904 may route the packets accordingly. Ifdesired, additional direct data communication links 925 may be providedbetween physically adjacent integrated circuit packages, as shown. Insome embodiments, all of links 724, 824, 924, 925 may be implementedusing package-to-package conductive paths such as those described above,coupled between edge contacts on the substrate assemblies of each of therespective integrated circuit packages, including the switch integratedcircuit package 904.

In some cases, multiple identical coprocessor or accelerator units maybe coupled together in a multi-processor arrangement for parallelprocessing in the manner described above, such that the combined computepower of the multiple individual units equals or exceeds that of asingle processing unit having a more sophisticated design than those ofthe individual units. For example, multiple lower-end GPUs may becoupled together in a ganged assembly and used to perform parallelcomputing in the manner described above, such that the performance ofthe ganged assembly of lower-end GPUs equals or exceeds that of asingle, higher-end GPU.

Physical realizations for the above-described package-to-packageconductive paths may take a variety of forms. FIG. 10 illustrates afirst example class of implementations 1000, wherein a single-chipconnector frame 1002 is provided to receive a substrate 1004 of anintegrated circuit package. In the embodiment shown in FIG. 10, thesubstrate is generally planar and has a top side 1005, a bottom side1007, and an edge 1008 extending between the top and the bottom sides.The substrate in the illustrated embodiment has a rectangular shape,such that it defines four edge sections, each corresponding to one ofthe four sides of the substrate. Conductive lands 1006 are formed on atleast one of the edge sections. The connector frame includescorresponding conductive lands 1010 disposed on an inside surface of theframe, as shown. Each of the lands on the frame corresponds to one ofthe lands on the edge of the integrated circuit package substrate. Asubstrate assembly is formed by inserting the substrate into the frame,as shown, and soldering, fusing, or otherwise electrically connectingthe lands on the substrate to the corresponding lands on the frame.

FIG. 11 is a sectional view of the substrate and connector frame of FIG.10, taken along the section indicated in FIG. 10. As can be seen in FIG.11, the electrical connection between each land on the substrate and thecorresponding land on the frame may be established by fusing a solderball 1100 formed on either the substrate land or the frame land prior toinserting the substrate into the frame. As the sectional view of FIG. 11illustrates, the lands on the substrate are coupled to one or moreplanes 1102 and vias 1104 formed in the substrate, using knowntechniques. The vias couple the lands on the substrate to circuitrywithin an integrated circuit die 1106 that is coupled to the substrate.The die may be coupled to any side of the substrate or may be housedinside it. The circuitry to which the lands are coupled may include, forexample, one or more data communication units 608 within the die, asdescribed above. Once assembled in this manner, the substrate and thesingle-chip connector frame constitute a substrate assembly having edgecontacts, wherein the edge contacts are provided by the connector frame.

Techniques for providing the edge contacts on a substrate assembly inaccordance with embodiments may vary. For example, FIG. 12 illustratesanother technique 1200 for coupling a single-chip connector frame to asubstrate. FIG. 12 is a sectional view corresponding to the view of FIG.11, except with some structural differences: First, frame 1202 has aslightly different structure than has frame 1002, as can be seen at1202. Second, substrate 1204 has lands 1206 formed on its top or bottomside 1205 instead of on its edge 1208. Nevertheless, once the substrateis assembled into the connector frame as shown, the substrate and theconnector frame form a substrate assembly having edge contacts, whereinthe edge contacts are provided by the connector frame, just as is thecase with the embodiments shown in FIGS. 10 and 11. In embodiments 1200,the connector frame extends partially over the top or bottom side of thesubstrate so that lands 1210 formed on the connector frame align withthe lands 1206 formed on the top or the bottom side of the substrate. Asolder ball 1212 may be attached to the land on either side of theconnection before the components are brought together, and then fused orre-flowed to establish the electrical connection between the connectorframe and the substrate. As was the case in the embodiments of FIGS. 10and 11, planes and vias inside substrate 1204 couple lands 1206 tocircuitry within integrated circuit die 1102, which is also coupled tothe substrate.

The embodiments of FIGS. 11 and 12 are shown with host system contacts1106 disposed on a bottom side 1007 of the substrate, and the hostsystem contacts are depicted as a ball grid array. As was describedabove, in other embodiments the host system contacts may take differentforms. For example, they may be implemented as a land grid array or as apin grid array as appropriate for a given application.

In either class of embodiments illustrated in FIGS. 11 and 12, theconnector frame provides a plurality of sockets 1300 disposed on an edge1112 of the substrate assembly. FIG. 13 is an orthogonal view relativeto the view of FIG. 12 and illustrates the face of one such socket. Eachsocket defines an opening 1302 configured to receive a removableconnecting pin such as the ones illustrated, by way of example, in FIG.14. Resilient electrical contacts 1304 are disposed inside of theopening and are configured to establish electrical contact with aconnecting pin when the pin is inserted into the socket. The resilientelectrical contacts are coupled to lands 1010, 1210 inside the connectorframe, as shown. In other embodiments, sockets 1300 may be formedintegrally with the substrate.

The connecting pins may take a variety of forms as well. FIG. 14illustrates two such forms by way of example. A removable connecting pin1400 may be constructed using any suitably rigid electrically conductivematerial, such as copper or steel. The pin may include a retentionfeature 1402 on either end. The retention feature may comprise anymechanism configured to engage with the resilient contacts inside thesocket 1300 so as to retain the pin within the socket after it isinserted. As the drawing illustrates, such a retention feature maycomprise a notch 1404 or a ridge 1406 formed near the end of the pin.Other suitable structures may also be used. Moreover, in anyembodiments, the package-to-package conductive paths between integratedcircuit packages of a ganged assembly may be provided by conductorsother than removable pins. For example, they may be provided by suitablecables having connectors thereon and configured to mate with the edgeconnectors of the integrated circuit packages.

Embodiments such as those described in relation to FIGS. 10-14 may beused to implement any of the systems described above. For example, asystem 1500 shown in FIG. 15 comprises four integrated circuit packages1502 coupled to one another with removable pins 1504 to form a meshnetwork such as those described in relation to FIGS. 1 and 7. Each ofsubstrate assemblies 1502 includes a single-chip connector frame 1506such as those described in relation to FIGS. 10-14. Similarly, FIG. 16illustrates a system 1600 comprising four integrated circuit packages1602 coupled to a switch integrated circuit package 1603 with removablepins 1604. As in system 1500, each of the integrated circuit packages insystem 1600, including the switch integrated circuit package, comprisesa single-chip connector frame 1606. Systems such as system 1600 may beused to implement all-to-all connection networks such as those describedin relation to FIG. 9.

A second example class of physical implementations for edge connectedpackage-to-package conductive paths is illustrated in FIGS. 17-21. Inthis class of embodiments (referring now to FIG. 7) a multi-chipconnector frame such as connector frame 1702 is provided, into which twoor more integrated circuit packages 1704 are inserted. To receive theintegrated circuit packages, the multi-chip connector frame includes twoor more edge-connector sockets 1706, each of which is large enough toaccommodate the size of a substrate assembly. In the embodimentillustrated, each edge-connector socket defines an opening in a centralregion 1708 thereof, so as to allow host contacts 1802 (see FIG. 18) onthe bottom or the top side of a substrate assembly to engagecorresponding host contacts on or in a PCB after the substrate assemblyis inserted into the socket. The multi-chip connector frame may beconstructed using any suitable known materials and techniques, such asplastic, PCB materials, or ceramic substrate materials.

FIG. 18 is a sectional view of the multi-chip connector frame of FIG.17, taken along the section indicated in FIG. 17—except that, forclarity of illustration, in FIG. 18 only one of the two integratedcircuit packages is shown seated inside its respective socket. Eachsocket of the multi-chip connector frame may include resilientelectrical contacts 1804 disposed around the perimeter of the socket.Each such resilient electrical contact is configured to engage with acorresponding land 1806 formed on an edge of a substrate assembly 1704.Connecting paths such as wires, planes and/or vias 1808 may be formed onor in the body of the frame, as shown. The connecting paths on or in theframe may be used to provide any or all of the package-to-packageconductive paths described above.

One or more resilient retention features 1810 may additionally beprovided on the multi-chip connector frame. The retention features 1810may be configured to retain an integrated circuit assembly in a socketafter insertion. Such retention features need not be, but can be, asnumerous as electrical contacts 1804. For example, in some embodiments,the retention features may be integrally formed with the electricalcontacts, as shown at 1810. In other embodiments, the retention featuresmay comprise separate resilient protrusions, as shown at 1812, whereinthe retention feature 1814 is separate from the resilient electricalcontact 1805. Other suitable structures may also be used for both theelectrical contacts and the retention features. In any case, theintegrated circuit packages, and the multi-chip connector frame intowhich the packages are inserted, together constitute a ganged assembly.

Embodiments such as those described in relation to FIGS. 17-18 may beused to implement any of the systems described above. For example, FIG.19 illustrates a system 1900 comprising four integrated circuit packages1902 housed in a multi-chip connector frame 1904. Conductors 1906disposed on or in the body of the connector frame establishpackage-to-package conductive paths that couple the edge contacts of thesubstrate assemblies in a mesh network topology such as those describedin relation to FIGS. 1 and 7. Similarly, FIG. 20 illustrates a system2000 comprising four integrated circuit packages 2002 housed in amulti-chip connector frame 2004. Conductors 2006 on or in the body ofthe connector frame couple edge contacts on the substrate assemblies inan all-to-all connectivity network such as those described in relationto FIG. 8. FIG. 21 illustrates a system 2100 comprising four integratedcircuit packages 2102, along with a switch integrated circuit package2103, all housed in a multi-chip connector frame 2104. Conductors 2106on or in the body of the connector frame couple edge contacts on thesubstrate assemblies of integrated circuit packages 2012 tocorresponding edge contacts on the substrate assembly of switchintegrated circuit package 2103, thus implementing a logical all-to-allconnectivity network such as those described in relation to FIG. 9.Conductors 2107 may also be provided on or in the body of the connectorframe to provide direct connections between edge contacts of physicallyadjacent integrated circuit packages, as shown, and also as described inrelation to FIG. 9.

Referring now to FIGS. 22 and 23A-C, a general method will be describedto manufacture edge-connected semiconductor systems such as thosedescribed above. The method begins at step 2202, during which two ormore integrated circuit packages are obtained, each having edge contactsthereon. FIG. 23A illustrates step 2202 for an embodiment in which foursuch integrated circuit packages 2302, 2304, 2306, 2308 have beenobtained. In the embodiment illustrated in FIG. 23A, the integratedcircuit packages are of the type having a single-chip connector frame asdescribed in relation to FIGS. 10-14. Thus, removable pins 2310 areinserted into sockets on the substrate assemblies of integrated circuitpackages 2302, 2306 as shown, in preparation for step 2304.

In step 2304, a ganged assembly is formed with the integrated circuitpackages by establishing conductive paths between their respective edgecontacts. In the embodiment illustrated in FIG. 23B, this isaccomplished by inserting the free ends of pins 2310 into sockets on thesubstrate assemblies of integrated circuit packages 2304, 2308, asshown. For embodiments such as those described in relation to FIGS.17-21, in which multi-chip connector frames are used, step 2204 may beperformed by inserting the integrated circuit packages into a multi-chipconnector frame, thereby establishing conductive paths between the edgecontacts on the respective integrated circuit packages via theconductors that are disposed on or in the body of the connector frame.For single-chip connector frame embodiments, additional pins 2312 may beinserted into the sockets on integrated circuit packages 2302, 2304 asshown in FIG. 23B, and then the ganged assembly may be completed byinserting the free ends of pins 2312 into the sockets of integratedcircuit packages 2306, 2308.

Having completed the ganged assembly, the method proceeds with step2206. In this step, the ganged assembly may be coupled to a PCB bycoupling host system contacts on the ganged assembly to correspondingcontacts on the PCB. For example, in the embodiment illustrated in FIG.23C, host contacts on the bottom or top sides of the substrateassemblies of integrated circuit packages 2302, 2304, 2306, 2308 may becoupled to corresponding contacts on or in PCB 2314 (or, as describedabove, into a socket that is coupled to the PCB). In other embodiments,a subset of the edge contacts on the ganged assembly may constitute thehost system contacts. In the latter embodiments, step 2206 may becompleted by coupling that subset of the edge contacts to correspondingcontacts on or in the PCB. As was described above, PCB 2314 mayconstitute a motherboard or system board, or it may constitute asubsystem such as an add-on card that is configured to be mounted to amotherboard or system board.

In the embodiment illustrated in FIG. 23C, the ganged assembly iscoupled to the PCB in a manner such that the planes of the substrateassemblies of the integrated circuit packages are substantially parallelto the plane of the PCB. In other embodiments, such as the oneillustrated in FIG. 5, the ganged assembly may be coupled to the PCB ina manner such that the planes of the substrate assemblies aresubstantially orthogonal to the plane of the PCB.

Multiple specific embodiments have been described above and in theappended claims. Such embodiments have been provided by way of exampleand illustration. Persons having skill in the art and having referenceto this disclosure will perceive various utilitarian combinations,modifications and generalizations of the features and characteristics ofthe embodiments so described. For example, steps in methods describedherein may generally be performed in any order, and some steps may beomitted, while other steps may be added, except where the contextclearly indicates otherwise. Similarly, components in structuresdescribed herein may be arranged in different positions or locations,and some components may be omitted, while other components may be added,except where the context clearly indicates otherwise. The scope of thedisclosure is intended to include all such combinations, modifications,and generalizations as well as their equivalents.

What is claimed is:
 1. A semiconductor system, comprising: at leastfirst and second integrated circuit packages, each of the packagescomprising a substrate assembly having top and bottom sides and an edgethat extends between the top and bottom sides, and each of the substrateassemblies comprising edge contacts disposed on the edge of thesubstrate assembly; a printed circuit board (“PCB”) to which the firstand second integrated circuit packages are coupled; andpackage-to-package conductive paths coupling edge contacts of the firstintegrated circuit package with edge contacts of at least the secondintegrated circuit package, wherein the package-to-package conductivepaths do not include traces on or inside the PCB.
 2. The semiconductorsystem of claim 1, wherein: each of the edge contacts comprises a socketconfigured to receive a removable pin; and the package-to-packageconductive paths comprise one or more of the removable pins.
 3. Thesemiconductor system of claim 1, wherein: the substrate assemblycomprises a connector frame; and the edge contacts are disposed on or inthe connector frame.
 4. The semiconductor system of claim 1, wherein:each of the integrated circuit packages has a rectangular shape suchthat its edge comprises four edge sections; in a first subset of theedge sections, the edge contacts are coupled to the package-to-packageconductive paths; and in a second subset of the edge sections, the edgecontacts are coupled to the PCB.
 5. The semiconductor system of claim 4,wherein the integrated circuit packages and the package-to-packageconductive paths constitute a first ganged assembly, and wherein thesemiconductor system further comprises: a second ganged assemblysubstantially identical to the first ganged assembly and coupled to thePCB adjacent to the first ganged assembly; and a cooling device disposedbetween the first and the second ganged assemblies and in thermalcontact with at least one integrated circuit package in each of thefirst and the second ganged assemblies.
 6. The semiconductor system ofclaim 1, wherein: each of the integrated circuit packages furthercomprises an integrated circuit die having data communication circuitrytherein coupled to at least some of the edge contacts of the respectiveintegrated circuit package; and the data communication circuitry isconfigured to exchange data between the integrated circuit packagesthrough the conductive paths.
 7. The semiconductor system of claim 6,wherein: each of the integrated circuit packages is substantiallyidentical to the others.
 8. The semiconductor system of claim 6,wherein: each of the integrated circuit packages comprises a digitaldata processor and a local memory associated with the data processor;and the data communication circuitry is configured to transfer data fromthe memory of the data processor in one of the integrated circuitpackages to the memory of the data processor in another of theintegrated circuit packages.
 9. The semiconductor system of claim 6,wherein: each of the integrated circuit packages comprises a graphicsprocessing unit.
 10. A method of manufacturing a semiconductor system,comprising: obtaining at least first and second integrated circuitpackages, each of the packages comprising a substrate assembly havingtop and bottom sides and an edge that extends between the top and bottomsides, and each of the substrate assemblies comprising edge contactsdisposed on the edge of the respective substrate assembly; forming aganged assembly of the first and the second integrated circuit packagesby establishing conductive paths that couple edge contacts of the firstintegrated circuit package with edge contacts of at least the secondintegrated circuit package; and coupling the ganged assembly to aprinted circuit board (“PCB”).
 11. The method of claim 10: wherein atleast one of the substrate assemblies comprises host system contactsdisposed on one of its top and bottom sides; and the coupling of theganged assembly to the PCB comprises coupling the host system contactsto corresponding contacts on or in the PCB such that the substrateassemblies are substantially parallel to the PCB.
 12. The method ofclaim 10, wherein: each of the integrated circuit packages has arectangular shape, such that the edge comprises four edge sections; theedge contacts of one of the edge sections comprise host system contacts;and coupling the ganged assembly to the PCB comprises coupling the hostsystem contacts to corresponding contacts on or in the PCB such that thesubstrate assemblies are substantially orthogonal to the PCB.
 13. Themethod of claim 10, wherein: forming the ganged assembly comprisesinserting the integrated circuit packages into a multi-chip connectorframe that is configured to provide the conductive paths.
 14. Asemiconductor system comprising: a first integrated circuit package, thefirst integrated circuit package comprising: a substrate assembly havingtop and bottom sides and an edge that extends between the top and thebottom sides; an integrated circuit die coupled to the substrateassembly and comprising a data processing unit, a memory associated withthe data processing unit, and a data communication unit; and first edgecontacts disposed on the edge of the substrate assembly and coupled tothe data communication unit.
 15. The semiconductor system of claim 14,wherein: the data communication unit is configured to be coupled tosecond edge contacts disposed on a second integrated circuit packagesubstantially identical to the first integrated circuit package.
 16. Thesemiconductor system of claim 15, wherein: the data communication unitis configured to implement memory transfer transactions with a seconddata communication unit disposed within the second integrated circuitpackage.
 17. The semiconductor system of claim 14, wherein: each of theedge contacts comprises a socket configured to receive a removable pin.18. The semiconductor system of claim 17, wherein: the substrateassembly comprises a connector frame; and the edge contacts are disposedon or in the connector frame.
 19. The semiconductor system of claim 14:wherein the substrate assembly has a rectangular shape such that itsedge comprises four edge sections, and the first edge contacts aredisposed along at least one of the four edge sections; and furthercomprising second edge contacts disposed along another of the four edgesections; wherein the second edge contacts are configured to be coupledto corresponding contacts on or in a printed circuit board (“PCB”). 20.The semiconductor system of claim 14, wherein: the substrate assemblyfurther comprises contacts disposed on the top or the bottom sidethereof and configured to be coupled to corresponding contacts on or ina printed circuit board (“PCB”).